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  3. February 1998

AR/Bond or PC/Bond

  • Subject: AR/Bond or PC/Bond
  • From: AlanPruitt@xxxxxxxxx (Alan Pruitt)
  • Date: Wed, 04 Feb 1998 15:25:15 -0500
  • Organization: KEMET Electronics
 
Is anyone using a product on the PC & AS/400 called AR/BOND.  We are running 
into problems using this product in a test of our new 
AS/400 Risc box and wonder if anyone else has experienced this.  The Software 
was written in Australia and is used to do APPC 
communications between the PC/and AS/400.  

TIA
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